Ultra-Fast Photonic Curing of Electrically Conductive Adhesives Fabricated from Vinyl Ester Resin and Silver Micro-Flakes for Printed Electronics

The team at Osaka University has been showing the value and advantages of PulseForge processes for a variety of materials for printed electronics for many years.

Citation

Cui, H. W., Jiu, J. T., Nagao, S., Sugahara, T., Suganuma, K., Uchida, H., & Schroder, K. A. (2014). Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics. Rsc Advances4(31), 15914-15922.

Leave a Comment

Your email address will not be published. Required fields are marked *

Scroll to Top